美国UDM AKLC300系列晶圆切削液

美国UDM AKLC300系列浓缩晶圆切削液 ? AKLC300洗涤剂浓缩液是一种可生物降解、水性、非碱性、非酸性物质? PV wafer Cleaning after wafering 用于切片之后对光伏硅片进行清洗? DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1 去离子水/反渗透水:洗涤剂溶液比例 – 1000:1至500:1 ? Application temperature: 45°C - 70°C 使用温度：45°C - 70°C ? Excellent wetting, cleaning and rinsing properties 极好的湿润、清洁和冲洗功能? Water surface tension reducer 降低去离子水/反渗透水表面张力? Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces 可以彻底清洁硅片表面的碳化硅(SiC)尘埃以及其他脏污? Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process. 在切片以及去胶工序之后彻底清除光伏硅片表面的铜和铁? Biodegradable, non-hazardous and hence easily disposable 可生物降解、无危害，可以很容易进行处置? Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L) 生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L) ? Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L) 化学需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L) 联系人：陈先生手机：13602588976